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Thermodynamic reassessment of Au-Ni-Sn ternary system

Referentgranskad
DOI
10.1016/j.calphad.2013.10.001
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry2013Publicationer information ikon

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Referentgranskad
DOI
10.1007/s11664-015-4152-3
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi
Journal of Electronic Materials2016Publicationer information ikon

Thermodynamic modeling of Au-Ce-Sn ternary system

Referentgranskad
DOI
10.1016/j.calphad.2013.07.013
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry2013Publicationer information ikon

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Referentgranskad
DOI
10.1016/j.microrel.2016.07.013
Vuorinen, Vesa; Rautiainen, A.; Heikkinen, Harri; Paulasto-Kröckel, Mervi
Microelectronics reliability2016Publicationer information ikon

Solid-state reactions between Cu(Ni) alloys and Sn

Referentgranskad
DOI
10.1007/s11664-007-0251-0
Vuorinen, Vesa; Laurila, Tomi; Mattila, Toni; Heikinheimo, Erkki; Kivilahti, Jorma
Journal of Electronic Materials2007Publicationer information ikon

On the Formation of the Intermetallic Compounds in the Sn-Cu-Ni-system

Referentgranskad
Vuorinen, V.; Kivilahti, J.
Helsinki University of Technology1997Publicationer information ikon

Formation of the Intermetallic Compounds between liquid Sn and Different Cu-Ni Metalization

Vuorinen, V.; Korhonen, T-M.; Kivilahti, J.K.
-2001Publicationer information ikon

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Referentgranskad
DOI
10.1016/j.jallcom.2016.07.129
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi
Journal of Alloys and Compounds2016Publicationer information ikon

Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes

Referentgranskad
DOI
10.1063/1.2166647
Vuorinen, V.; Laurila, T.; Yu, H.; Kivilahti, J. K.
Journal of Applied Physics2006Publicationer information ikon

Interfacial Phase Formation in Sn-Ag-Cu Solder Joints with Ni/Au Coated Boards

Referentgranskad
Zeng, Kejun; Vuorinen, Vesa; Kivilahti, Jorma K.
IEEE Transactions on Components, Packaging and Manufacturing Technology2002

Thermodynamic reassessment of Au-Ni-Sn ternary system

Referentgranskad
DOI
10.1016/j.calphad.2013.10.001
2013

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Referentgranskad
DOI
10.1007/s11664-015-4152-3
2016

Thermodynamic modeling of Au-Ce-Sn ternary system

Referentgranskad
DOI
10.1016/j.calphad.2013.07.013
2013

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Referentgranskad
DOI
10.1016/j.microrel.2016.07.013
2016

Solid-state reactions between Cu(Ni) alloys and Sn

Referentgranskad
DOI
10.1007/s11664-007-0251-0
2007

On the Formation of the Intermetallic Compounds in the Sn-Cu-Ni-system

Referentgranskad
1997

Formation of the Intermetallic Compounds between liquid Sn and Different Cu-Ni Metalization

2001

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Referentgranskad
DOI
10.1016/j.jallcom.2016.07.129
2016

Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes

Referentgranskad
DOI
10.1063/1.2166647
2006

Interfacial Phase Formation in Sn-Ag-Cu Solder Joints with Ni/Au Coated Boards

Referentgranskad
2002