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Characterisation of RF Connectors and Components for Advanced 5G Applications

Referentgranskad
Öppen tillgång
DOI
10.1109/ectc51906.2022.00153
Rasilainen, Kimmo; Leinonen, Marko E.; Kursu, Olli; Nevala, Klaus; Naushahi, Shayan Hasan; Ojakoski,...
Proceedings - Electronic Components Conference2022Publicationer information ikon

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Referentgranskad
DOI
10.1109/ECTC.2013.6575770
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, James; He...
Electronic Components and Technology Conference (ECTC)2013Publicationer information ikon

Inservice inspections of reactor pressure components and pipings in Finland

Kauppinen, Pentti; Forsten, Jarl
I Mech E Conference Publications1979Publicationer information ikon

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Referentgranskad
DOI
10.1109/ECTC.2015.7159772
Zoschke, K.; Manier, C-A.; Wilke, M.; Oppermann, H.; Fuffieux, D.; Dekker, James; Jaakkola, Antti; D...
Electronic Components and Technology Conference (ECTC)2015Publicationer information ikon

Evaluating the Integrability of COTS Components: Software Product Family Viewpoint

DOI
10.1007/3-540-27071-X_8
Immonen, Anne; Niemelä, Eila; Matinlassi, Mari
Springer2005Publicationer information ikon

Evaluating the integrability of COTS components - software product family viewpoint

Immonen, A.; Niemelä, Eila & Matinlassi, M.
Springer2005Publicationer information ikon

Characterization of WDM components

Referentgranskad
Genty, G.; Niemi, T.; Ludvigsen, H.
-1999Publicationer information ikon

Long-life spectrum fatigue of welded components, experiments and analysis

Referentgranskad
Solin, Jussi; Marquis, Gary
International Conference on Fatigue of Welded Components and Structures1996Publicationer information ikon

Damage detection in CFRP components using DIC

Referentgranskad
DOI
10.1007/978-3-319-22446-6_7
Antin, Kim Niklas; Harhanen, Lauri; Bossuyt, Sven
Conference Proceedings of the Society for Experimental Mechanics Series2016Publicationer information ikon

From Neural Principal Components to Neural Independent Components

Referentgranskad
Oja, E.; Karhunen, J.; Hyvärinen, A.
-1997

Characterisation of RF Connectors and Components for Advanced 5G Applications

Referentgranskad
Öppen tillgång
DOI
10.1109/ectc51906.2022.00153
2022

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Referentgranskad
DOI
10.1109/ECTC.2013.6575770
2013

Inservice inspections of reactor pressure components and pipings in Finland

1979

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Referentgranskad
DOI
10.1109/ECTC.2015.7159772
2015

Evaluating the Integrability of COTS Components: Software Product Family Viewpoint

DOI
10.1007/3-540-27071-X_8
2005

Evaluating the integrability of COTS components - software product family viewpoint

2005

Characterization of WDM components

Referentgranskad
1999

Long-life spectrum fatigue of welded components, experiments and analysis

Referentgranskad
1996

Damage detection in CFRP components using DIC

Referentgranskad
DOI
10.1007/978-3-319-22446-6_7
2016

From Neural Principal Components to Neural Independent Components

Referentgranskad
1997