The current global geo-political situation demands resilience of semiconductor value chain, necessitating improvement in research and development infrastructures for Europe. Tampere University together with the City of Tampere is intensifying its research activity around Semiconductor Chip design, fabrication and packaging. Two major steps in this direction are SoC Hub ecosystem and SiPFab for design, fabrication /packaging of advanced chips. A crucial complementary missing piece in the current Tampere Chips infrastructure is the set of tools necessary to perform characterization of the advanced devices, integrated circuits and systems. ChipIn aims to fill the gap by providing the characterization infrastructure and analysis platform, strengthening Chips from Tampere initiative. The project will serve a wide range of research and innovation area including artificial intelligence (AI), hardware security, telecommunication and many other sectors.

2026

2028